• +41 (0)32 926 26 06
  • info@plasmadiam.com
  • +41 (0)32 926 26 06
  • info@plasmadiam.com
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iTrap® Process Gas Analyzers

iTrap® Process Gas Analyzers

Process Gas Analyzers

iTrap® is a compact, highly sensitive ion trap Fourier Transform mass spectrometer. It is an ideal tool for process analysis and inline process control. 

Edwards Process Gas Analyzer - Real time process control for Semiconductor applications

It can be used in R&D and production environments. iTrap supports you reliably in detecting the smallest traces of reaction byproducts or contamination, it helps you to investigate effectiveness of cleans and analyze chamber health. A mass spectrum is measured in almost real time, and you can trace very small amounts of molecules in your process chamber. iTrap is a powerful tool in the hands of a researcher or process development engineer and can also be used as an intelligent sensor integrated and controlled by other process tool equipment.

Benefits

Edwards iTrap convinces through: 

  • Speed | Real time measurements possible, full spectrum in < 0.5 sec
  • Sensitivity | Small trace concentration measurements 
  • Compactness | Can be integrated with a process chamber. Standardized software interface ready for external chemicals. 
  • Robustness against corrosives | Inert surface, No detectors. Withstands H2, Cl, F and other aggressive chemicals 
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S800

Compact hard PVD
Functional Coating

  • Compact system (W3400 x D3000 x H2300mm)
  • Utilities in a single part of the unit
  • Extremely short utility commissioning
  • Fast to install

General Information

  • Technology : Arc
  • Dimensions : W3400 x D3000 x H2300 mm
  • Vacuum chamber size : W800 x D800 x H1,150 mm
  • Vacuum chamber capacity : 730 l
  • Using plasma volume : D=550 x H720
  • Target : 727×178×18 mm (3Set) - 200/400/400A
  • Turntable : D436 × H727 mm
  • Power : 3×400V/120 kW
  • Software : Industrial PC system Simple and easy diagnosis and description system Remote diagnosis through data machine or IP

Coating types

  • Standards Coating : TiN, CrN, TiCN, TiAlN, AlTiN, etc.
  • Recipes can be selected : AlCrN, TiAlSiN, AlCrTiN, DLC, etc.
  • Capacity (24H)
  • Milling cutter : D6×50 mm = 1,800×5 = 9,000 pces - D16×95 mm = 450×5= 2,250 pces
  • Insert : D20×H6 mm = 2,340×5 = 11,700 pces
  • Hobs : D80×180 mm =24×5= 120 pces

Testing Chamber

Applications : The bench top system offered allows to reach and maintain pressures equivalent to “O” meter (Atmospheric pressure) to high level such 4000 meters and beyond, inside a test chamber.

Atmospheric Pressure Simulator Chamber

  • Programmable vacuum controller

High Vacuum Pumping Stations

Vacuum Ovens bake, degas, heat, dry and anneal components for the electronics, aerospace and defence industries. Our systems come in multiple cylindrical or cubic configurations.
Plug & Pump

PLASMADIAM TURBOMOLECULAR PUMPING STATION:

  • Range of turbomolecular pump options
  • Choice of turbomolecular pump with speeds ranging from 85 to 930 ls-1
  • Choice of dry backing pumps with capacities ranging from 6 to 90 m3h-1

Vacuum Heat Treatment Furnace

Heat treatment to fix the shape of the spiral spring. The fixing heat treatment is carried out under the following conditions :
  • Between 10-7 mbar and 10-5 mbar, in an inert atmosphere
  • Temperature between 400°C and 1000°C
  • Time between 1h and 6h

Advantages of vacuum furnaces

  • Controlled heating
  • Reproducible process
  • High efficiency
  • Fasting heating & cooling
  • High Vacuum Pumping Group

Ultra High Vacuum System Bake Out

Vacuum Ovens bake, degas, heat, dry and anneal components for the electronics, aerospace and defence industries. Our systems come in multiple cylindrical or cubic configurations.

Example

  • Temperature 300 degrees
  • Vacuum level 5.10-10 mbar
  • Fully automated cycles
  • LOG recording